Effect of process parameters on microstructure and electrical conductivity during FSW of Al-6101 and Pure Copper
Author:
Publisher
IOP Publishing
Subject
Metals and Alloys,Polymers and Plastics,Surfaces, Coatings and Films,Biomaterials,Electronic, Optical and Magnetic Materials
Link
http://iopscience.iop.org/article/10.1088/2053-1591/aabbe0/pdf
Reference28 articles.
1. Joining of aluminium and copper materials with friction welding
2. Effect of electrical current on the morphology and kinetics of formation of intermetallic phases in bimetallic aluminum-copper joints
3. Solid-state welding of aluminum to copper—case studies
4. Joining of dissimilar materials with friction stir welding
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