Modeling dynamic recrystallization behavior of Al-Zn-Mg-Cu alloy during electroshock assisted tension based on cellular automata

Abstract

Abstract Electroshock assisted forming of high-strength aluminum alloy is a new type of plasticizing manufacturing method. To study the dynamic recrystallization (DRX) behavior of Al-Zn-Mg-Cu alloy during low-frequency electroshock assisted tension, a cellular automata (CA) model coupled electro-thermal-mechanical multi-field effect was proposed on the Matlab platform. In the established CA model, the effect of additional driving force generated by the electric pulse on the dynamic recrystallization nucleation and growth has been innovatively taken into account. The grain diameters obtained by the above CA model are consistent with that obtained by the electron back scatter diffraction (EBSD) tests, which verified the accuracy of the model. The effects of current density and electrical pulse period on grain morphology, average grain diameter, DRX fraction, and grain size distribution were analyzed. Additionally, the optimal parameters of electroshock assisted tensile (current density of 30 A·mm−2, pulse period of 5 s) were predicted by the CA method. At this time, the DRX fraction increased to 45.79% and the fracture elongation of unidirectional tensile specimen increased by 21.74%.