The effects of finite metallisation thickness and conductivity in microstrip lines

Author:

Gao Bo,Tong Ling,Gong Xun

Abstract

PurposeThe purpose of this paper is to study and discuss the effects of the finite metallisation thickness and conductivity on the properties of microstrip lines.Design/methodology/approachEffective dielectric constant and attenuation constant of microstrip lines with finite metallization thickness and finite conductivity are analyzed by the method of lines. The experimental results are obtained by using Vector Network Analyzer and the 3680 V Universal Test Fixture of Anritsu.FindingsThe strip thickness has a great impact on the attenuation constant of the microstrip lines. The effects can be divided into three parts by the relationship between strip thickness (t) and skindepth (δ). When t<δ, the attenuation constant will decrease rapidly as the strip thickness increase. When δ < t<2δ, the attenuation constant still decrease rapidly as the strip thickness increase, but the slope of the curve will be smaller. When 2δ < t, the effects of the strip thickness will become insignificant and the attenuation constant still decrease slowly as the strip thickness increase.Originality/valueThis paper presents some useful principles about the effects of the finite metallization thickness and finite conductivity in microstrip lines. The reasons for these effects are discussed by analyzing the longitudinal electric field distribution in the strip. Finally, some experimental results are given to verify these principles.

Publisher

Emerald

Subject

Applied Mathematics,Electrical and Electronic Engineering,Computational Theory and Mathematics,Computer Science Applications

Reference9 articles.

1. Diestel, H. (1987), “Analsis of planar multiconductor transmission‐line systems with the method of lines”, AEÜ, Band 41, pp. 169‐75.

2. Ke, J.‐Y. and Chen, C.H. (1995), “Modified spectral‐domain approach for microstrip lines with finite metallization thickness and conductivity”, IEE Proceedings Microwaves, Antennas and Propagation, Vol. 142 No. 4, pp. 357‐63.

3. Kollipara, R.T. and Tripathi, V.K. (1992), “Dispersion characteristics of moderately thick microstrip lines by the spectral domain method”, IEEE Microwave and Guided Wave Letters, Vol. 2 No. 3, pp. 100‐1.

4. Pregla, R. (2008), Analysis of Electromagnetic Fields and Waves: The Method of Lines, Wiley, Chichester.

5. Schmuckle, F.J. and Pregla, R. (1990), “The method of lines for the analysis of lossy planar waveguides”, IEEE Transactions on Microwave Theory and Techniques, Vol. 38 No. 10, pp. 1473‐9.

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