Author:
Yin Yong,Luo Hualiang,Sa Jiming,Zhang Qi
Abstract
Purpose
The segmentation of printed circuit board (PCB) images is an important process in PCB inspection. The circuit traces, pads and vias in a PCB are dense and curved, and the PCB image obtained using different cameras or in different conditions may exhibit a large image gradient, which leads to inaccuracy and inefficiency in the PCB image segmentation. This paper aims to propose an improved local binary fitting level set method with prior graph cut, aiming to improve the accuracy and efficiency of the segmentation of PCB images obtained using different cameras or in different environments.
Design/methodology/approach
First, the paper constructs a 4-connected undirected graph using a given PCB image and classifies it based on the graph cut. Second, an adaptive initialization level set is implemented using the priori information obtained from the graph cut. Finally, the paper constructs a priori energy term using the prior information and introduces it into the energy function of the level set.
Findings
The approach results in an improved accuracy of segmentation in the context of a large gradient within the image. Experimental results demonstrate that the method can solve the deviation of artificially initialized level set from targets and improve the efficiency and accuracy of segmentation.
Research limitations/implications
This study only considers level set method as the research object. Iteration of the level set method takes a long time for a given huge PCB picture, which makes it impossible to apply to scenes with high real-time requirements.
Practical implications
PCB image segmentation is an important process in the PCB inspection. Since template matching and morphology techniques are well-established, image segmentation quality has a significant impact on the accuracy of detection.
Originality/value
This paper studies the segmentation of PCB images, improves the efficiency and accuracy of segmentation and facilitates the subsequent applications, such as in the nondestructive testing of PCB.
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering
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