Author:
Meng Xu,Tan Shujie,Ding Liping,Zhang Yicha,Chen Liheng
Abstract
Purpose
The objective of this study is to investigate the feasibility of using selective laser melting (SLM) process to print fine capillary wick porous structures for heat pipe applications and clarify the interrelations between the printing parameters and the structure functional performance to form guidelines for design and printing preparation.
Design/methodology/approach
A new toolpath-based construction method is adopted to prepare the printing of capillary wick with fine pores in SLM process. This method uses physical melting toolpath profile with associated printing parameters to directly define slices and assemble them into a printing data model to ensure manufacturability and reduce precision loss of data model transformation in the printing preparation stage. The performance of the sample was characterised by a set of standard experiments and the relationship between the printing parameters and the structure performance is modeled.
Findings
The results show that SLM-printed capillary wick porous structures exhibit better performance in terms of pore diameter and related permeability than that of structures formed using traditional sintering methods, generally 15 times greater. The print hatching space and infilling pattern have a critical impact on functional porosity and permeability. An empirical formula was obtained to describe this impact and can serve as a reference for the design and printing of capillary wicks in future applications.
Originality/value
This research proves the feasibility of using SLM process to printing functional capillary wicks in extremely fine pores with improved functional performance. It is the first time to reveal the relations among the pore shapes, printing parameters and functional performance. The research results can be used as a reference for heat pipe design and printing in future industrial applications.
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering
Cited by
5 articles.
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