The effect of PECVD SiNx moisture barrier layers on the degradation of a flip chip underfill material-Reference-Cited by-同舟云学术

The effect of PECVD SiNx moisture barrier layers on the degradation of a flip chip underfill material

Published:2001-12-01 Issue:3 Volume:13 Page:12-15
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:

Author:

Kaltenpoth G.,Siebert W.,Xie X‐M.,Stubhan F.

Abstract

Flip chip test boards with and without plasma enhanced chemical vapor deposition silicon nitride moisture barrier coatings were exposed to high humidity and temperature cycling conditions. The effect of the stress developed in these environments was investigated and evaluated. The influence of the barrier layers on the extent of underfill delamination and degradation in flip chip assemblies was inspected by C‐mode Scanning Acoustic Microscopy. The moisture barrier layers studied show their potential to enhance the reliability of flip chip assemblies in humid environments.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference13 articles.

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