Author:
Wang Feng,Zhang Fangfang,Huang Qixiang,Salmani Mohammad
Abstract
Purpose
The purpose of this paper is to propose a method with capability of short-time implementation.
Design/methodology/approach
This paper was directed using both experimental tests and simulations to propose a comprehensive method for lifetime estimation of the solder joints.
Findings
A new method with good agreement with experimental tests has been proposed.
Originality/value
It is confirmed that paper is original.
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献