Process planning method for mask projection micro‐stereolithography

Abstract

PurposeMask projection micro‐stereolithography (MPμSLA) is an additive manufacturing process capable for fabricating true three‐dimensional microparts and hence, holds promise as a potential 3D MEMS fabrication process. With only a few MPμSLA systems developed and studied so far, the research in this field is inchoate and experimental in nature. In order to employ the MPμSLA technology for microfabrication, it is necessary to model its part building process and formulate a process planning method to cure dimensionally accurate microparts. The purpose of this paper is to formulate a process planning method for curing dimensionally accurate layers.Design/methodology/approachA MPμSLA system is designed and assembled. The process of curing a single layer in resin using this system is modeled as the layer cure model. The layer cure model is validated by curing test layers. This model is used to formulate a process planning method to cure dimensionally accurate layers. The process planning method is tested by conducting a case study.FindingsThe layer cure model is found to be valid within 3 percent for most of the features and within 10 percent for very small features (<250μm). The paper shows that ray tracing can be effectively used to model the process of irradiation of the resin surface in a MPμSLA system.Research limitations/implicationsThe process planning method is applicable only to those imaging systems, which are aberration limited as opposed to diffraction limited. The dimensional errors in the lateral dimensions of single layers cured by MPμSLA have been modeled, but not the vertical errors in 3D parts.Originality/valueIn this paper, a process planning method for MPμSLA has been presented for the first time.