Effect of hydrogen on semiconductor properties and pitting initiation of 2205 duplex stainless steel passivation film

Author:

Zheng Chuanbo,Huang Jiayan,Yi Gua

Abstract

Purpose This paper aims to study the effect of current density of hydrogen charging on the semiconductor properties and pitting initiation of 2205 duplex stainless steel (DSS) passivation film. Design/methodology/approach In this work, the 2205 DSS is pre-hydrogenated and passivated. Then, the passivation film is tested by electrochemical impedance method, Mott–Schottky curve method and dynamic potential scanning method. The influences of hydrogen on the properties of the passivation film and the corrosion behavior of the matrix were studied by analyzing the curves obtained in the electrochemical test. The surface of the passivation film after pre-hydrogenation and anodic polarization was observed by using the ultra-depth three-dimensional microscopy and the scanning electron microscope. The integrity, density and corrosion morphology of the passivation film were studied and discussed. Findings With the increase of the hydrogen current density, the growth of the passivation film is hindered, the concentrations of donor and acceptor in the film are increased, the conductivity of the passivation film increases. In the anodic polarization, the dimensional passive current density increases with the increase of the hydrogen current density, and the pitting potential is reversed, the more likely the sample is pitting. In general, hydrogen hinders the formation of the passive film on duplex stainless steel, which increases the concentration of point defects in the passive film. Finally, the passive film is easy to crack and pitting. Originality/value The performance of passive film is an important condition to influence the corrosion behavior of stainless steel. However, little research has been done on the effects of hydrogen on the electrochemistry and pitting sensitivity of 2205 DSS passivation films. The effect of hydrogen on semiconductor properties and pitting initiation of 2205 DSS passivation film is needed to be investigated.

Publisher

Emerald

Subject

General Materials Science,General Chemical Engineering

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