Reliability aspects of electronic devices for advanced requirements
Author:
Publisher
Emerald
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering
Reference10 articles.
1. Material-Dependent Reliability Characteristics of Lead-Free Solder Joints
2. Experimental Damage Mechanics of Microelectronics Solder Joints under Concurrent Vibration and Thermal Loading
3. The compatibility of epoxy‐based printed circuit boards with lead‐free assembly
4. Printed circuit boards for lead‐free soldering: materials and failure mechanisms
5. Krapp, M.et al.(2003), “Zukünftige Anforderungen an Leiterplatten, Bauelemente und die Aufbau‐ und Verbindungstechnik für die Automobilelektronik”,Produktion von Leiterplatten und Systemen, Vol. 5 No. 11, pp. 1781‐7.
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1. Multidimensional Grey Evaluation Method for Aeronautic Electronic Components & Devices Selection;Applied Mechanics and Materials;2012-11
2. Processing and qualification of polymer based pastes in electronics production;Physics Procedia;2010
3. Influences on the reflow soldering process by components with specific thermal properties;Circuit World;2009-08-21
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