Reliability of flip chips on FR‐4 assembled with reduced process steps-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Reliability of flip chips on FR‐4 assembled with reduced process steps

Published:2001-09 Issue:3 Volume:27 Page:26-30
ISSN:0305-6120
Container-title:Circuit World
language:en
Short-container-title:Circuit World

Author:

Zhong Zhaowei

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Reference2 articles.

1. Goh, K.S. (1999), Chip on Flex and Flip Chip on Flex Technology, MSc Dissertation of Nanyang Technological University, Singapore.

2. Zhong, Z.W. and Goh, K.S. (1999), “Assembly and reliability of flip chip on various substrate materials”, Proceedings of 1st International Workshop on Electronics Materials and Packaging (EMAP ’99), Singapore, pp. 12‐20.

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Quetiapine versus risperidone in elderly patients with behavioural and psychological symptoms of dementia: Efficacy, safety and cognitive function;European Psychiatry;2007-05-04

2. Various Adhesives for Flip Chips;Journal of Electronic Packaging;2005-03-01

3. Deformations of a simplified flip chip structure under thermal testing inspected using a real-time Moiré technique;The International Journal of Advanced Manufacturing Technology;2005-02-16

4. Interfacial behavior of a flip-chip structure under thermal testing;IEEE Transactions on Electronics Packaging Manufacturing;2004-01

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP