Author:
Ciocci Richard,Pecht Michael
Abstract
Eliminating lead in electronics is an environmentally considerate approach that is made prior to manufacture. Recently enacted legislation encourages increased recycling of electrical and electronic products. However, recycling is typically an end‐of‐use action occurring just before final disposal. From an environmentally‐considerate perspective, lead elimination or replacement is a better approach. Short of having a definitive study to follow, industry, regulators, and consumers are proceeding with the change. Various lead‐free alloys have been tested and used for electronic components and assemblies. There are many replacements for eutectic tin‐lead solder, and alloys containing tin, silver, copper, and bismuth have been used successfully. Assessing how the electronics industry is addressing the change to lead‐free materials and processes requires answers to various questions. These questions regard the effects of changes to electronic products and their processes. What drives lead‐free migration, how processes can develop, and when products will be available are issues which define the assessment.
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering
Reference34 articles.
1. Allsopp, M., Costner, P. and Johnston, P. (2001), Incineration and Human Health, Greenpeace Research Laboratories, University of Exeter, UK.
2. Bastecki, C. (1999), “A benchmark process for the lead‐free assembly of mixed technology PCBs”, Cookson Electronics Assembly Materials, available at: http://www.alphametals.com/products/lead_free/PDF/leadfree.pdf (Accessed: 6 August 2003).
3. Beath, J. and Katsoulacos, Y. (1991), The Economic Theory of Product Differentiation, Cambridge University Press, Cambridge.
4. Cascio, J. (1993), “International standards activity: environmental standards”, IPC 1993 Fall Meeting, 25‐28 October 1993, pp. 164‐93.
5. Condra, L., Anissipour, A., Mayfield, D. and Pecht, M. (1997), “Electronic components obsolescence”, IEEE Transactions on Components, Packaging and Manufacturing Technology ‐‐ Part A, Vol. 20 No. 3, pp. 368‐71.
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