Assessment of risk resulting from unattached tin whisker bridging-Reference-Cited by-同舟云学术

Assessment of risk resulting from unattached tin whisker bridging

Published:2007-02-13 Issue:1 Volume:33 Page:5-8
ISSN:0305-6120
Container-title:Circuit World
language:en
Short-container-title:Circuit World

Author:

Fang Tong,Mathew Sony,Osterman Michael,Pecht Michael

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Reference7 articles.

1. Brusse, J. (2002), “Tin whisker observations on pure tin‐plated ceramic chip capacitors”,AESF SUR/FIN Proceedings, June 24‐27.

2. Statistical analysis of tin whisker growth

3. Tin whisker risk assessment

4. Fang, T., Mathew, S., Osterman, M. and Pecht, M. (2006), “Assessing tin whisker risk in electronic products”,SMT Magazine, Vol. 20 No. 5, pp. 24‐5.

5. Fukuda, Y., Fang, T., Pecht, M. and Osterman, M. (2004), “Effect of heat treatment on tin whisker growth”,Proceedings of the International SMTA Conference, Chicago, IL, September 26‐30, pp. 717‐23.

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