Process development for PWB compatible embedded capacitors

Author:

Bhattacharya Swapan K.,Markondeya Raj P.,Balaraman Devarajan,Windlass Hitesh,Tummala Rao R.

Abstract

This paper addresses materials and processes for printed wiring board compatible embedded capacitors using polymer/ceramic nanocomposites and hydrothermal barium titanate. Polymers allow low temperature fabrication appropriate to the board (MCM‐L) technology. The lower dielectric constants of the commercially available polymers can be greatly compensated by incorporating higher permittivity ceramic fillers. Materials requirements for higher capacitance density (>30 nF/cm2) have been addressed through implementation of a novel low‐temperature processable hydrothermal barium titanate film on a patterned titanium foil laminated to the PWB. Application of hydrothermal grown barium titanate is currently being evaluated using a multi‐layer system‐on‐package demonstration.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Reference10 articles.

1. Bacsa, R., Ravindranathan, P., Dougherty, J.P. and Kingon, J.P. (1992), “Hydrothermal synthesis of barium titanate thin films on titanium metal substrates”, Ferroelectric Thin Films II Symposium, pp. 431‐6.

2. Balaraman, D., Markondeya Raj, P., Abothu, I., Bhattacharya, S., Dalmia, S., Wan, L., Swaminathan, M. and Tummala, R. (2003), “Integration and high‐frequency characterization of PWB‐compatible pure barium titanate films synthesized by modified hydrothermal techniques below 100°C”, 53rd Electronic Components and Technology Conference, May 2003, New Orleans, pp. 1520‐7.

3. Bhattacharya, S. and Tummala, R. (2000), “Next generation integral passives: materials, processes, and integration of resistors and capacitors on PWB substrates”, Journal of Materials Science, Materials in Electronics, Vol. 11, pp. 253‐68.

4. Bhattacharya, S. and Tummala, R. (2002), “Epoxy nanocomposite capacitors for application as MCM‐L compatible integral passives”, ASME Journal of Electronic Packaging, Vol. 124, pp. 1‐6.

5. Fan, L., Kumashiro, Y. and Wong, C.P. (2003), “Integral capacitor dielectrics based on polymer composites with specialty conductive fillers”, 53rd Electronic Components and Technology Conference, May 2003, New Orleans, pp. 167‐72.

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