Modeling of multi‐layer circuit boards by using a model of bi‐phase and elasto‐plastic plies
Author:
Publisher
Emerald
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering
Reference12 articles.
1. Multi-layered multi-material finite element for crashworthiness studies
2. Computational methods for predicting impact damage in composite structures
3. Erratum
4. Drop-impact cushioning effect of electronics products formed by plates
5. A virtual boundary model for a quick drop–impact analysis of electronic components in TV model
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4. Hybrid modeling of woven fibre reinforced metal matrix composite for multilayer circuit boards;Circuit World;2008-05-16
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