Connection of electronic and microelectronic modules-Reference-Cited by-同舟云学术

Connection of electronic and microelectronic modules

Published:2014-04-29 Issue:2 Volume:31 Page:86-89
ISSN:1356-5362
Container-title:Microelectronics International
language:en
Short-container-title:

Author:

Sandera Josef

Abstract

Purpose – The purpose of this article is to describe the design of electronic and microelectronic modules and, in particular, it focuses on connecting system of electrical modules to the main board of printed board. The theory of thermomechanical loading of system is presented. New methods of rigid solder connection for electronic modules are also presented. Design/methodology/approach – A newly developed system with chip or cylindrical components is presented. The article describes a practical solution of connection with 0.603 and mini-metal electrode leadless face (MELF) surface mount device (SMD) resistors. Findings – A new method of rigid solder connection for electronic modules is presented. This system is original and patented. Practical implications – This solution is not used yet. Testing of a new system is executed now. Originality/value – This article shows a real and original construction with chip and cylindrical chip components.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference9 articles.

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2. Engelmaier, W. (2009), “Solder joint reliability prediction for chip components, MELFs, TSOPs, SOTs”, Global SMT & Packaging, Vol. 9 No. 7, June 2009, pp. 30-32.

3. Krajicek, M. (2011), “Thermomechanical reliability of solder connection in electronic modules with LTCC”, Master project, Brno University of Technology, Faculty of Electrical Engineering and Communication, supervisor Josef Sandera, Brno.

4. Okinaga, N. , Kuroda, H. and Nagai, Y. (2001), “Excellent reliability of solder ball made of compliant plastic core”, in Proceeding of the 51st Electronic Components and Technology Conference, Orlando, FL, May 29.

5. Sandera, J. (2010), “Reliability of electronic modules connected with chip components”, in Proceedings of the EDS'10, IMAPS CS International Conference 2010, Brno, Czech Republic, 1-2 September, pp. 282-285, ISBN 978-80-214-4138-5.

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