An evaluation of synthetic jets for heat transfer enhancement in air cooled micro‐channels

Author:

Timchenko Victoria,Reizes John,Leonardi Eddie

Abstract

PurposeThe development of novel cooling techniques is needed in order to be able to substantially increase the performance of integrated electronic circuits whose operations are limited by the maximum allowable temperature. Air cooled micro‐channels etched in the silicon substrate have the potential to remove heat directly from the chip. For reasonable pressure drops, the flow in micro‐channels is inherently laminar, so that the heat transfer is not very large. A synthetic jet may be used to improve mixing, thereby considerably increasing heat transfer. This paper seeks to address this issue.Design/methodology/approachCFD has been used to study the flow and thermal fields in forced convection in a two‐dimensional micro‐channel with an inbuilt synthetic jet actuator. The unsteady Navier‐Stokes and energy equations are solved. The effects of variation of the frequency of the jet at a fixed pressure difference between the ends of the channel and with a fixed jet Reynolds number, have been studied with air as the working fluid. Although the velocities are very low, the compressibility of air has to be taken into account.FindingsThe use of a synthetic jet appreciably increases the rate of heat transfer. However, in the frequency range studied, whilst there are significant changes in the details of the flow, due primarily to large phase changes with frequency, there is little effect of the frequency on the overall rate heat transfer. The rates of heat transfer are not sufficiently large for air to be a useful cooling medium for the anticipated very large heat transfer rates in future generations of microchips.Research limitations/implicationsThe study is limited to two‐dimensional flows so that the effect of other walls is not considered.Practical implicationsIt does not seem likely that air flowing in channels etched in the substrate of integrated circuits can be successfully used to cool future, much more powerful microchips, despite a significant increase in the heat transfer caused by synthetic jet actuators.Originality/valueCFD is used to determine the thermal performance of air flowing in micro‐channels with and without synthetic jet actuators as a means of cooling microchips. It has been demonstrated that synthetic jets significantly increase the rate of heat transfer in the micro‐channel, but that changing the frequency with the same resulting jet Reynolds number does not have an effect on the overall rate of heat transfer. The significant effect of compressibility on the phase shifts and more importantly on the apparently anomalous heat transfer from the “cold” air to the “hot” wall is also demonstrated.

Publisher

Emerald

Subject

Applied Mathematics,Computer Science Applications,Mechanical Engineering,Mechanics of Materials

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