Natural convection in vertical channels with an auxiliary plate

Author:

Andreozzi Assunta,Manca Oronzio,Naso Vincenzo

Abstract

Research on natural convection in open channels is very extensive due to its role in many engineering applications such as thermal control of electronic systems. In this paper, a parametric analysis is carried out in order to add knowledge of heat transfer in air natural convection for a symmetrically heated vertical parallel plate channel with a central auxiliary heated or adiabatic plate. The two‐dimensional steady‐state problem is solved by means of the stream function–vorticity approach and the numerical solution is carried out by means of the control volume method. Results are obtained for both a heated and unheated auxiliary plate, for a Rayleigh number in the range 103–106, for a ratio of the auxiliary plate height to the channel plate height equal to 0, 0.5 and 1 and for a ratio of the channel length to the channel gap in the range 5–15. Correlations for maximum wall temperatures and average channel Nusselt numbers are proposed.

Publisher

Emerald

Subject

Applied Mathematics,Computer Science Applications,Mechanical Engineering,Mechanics of Materials

Reference22 articles.

1. Andreozzi, A. and Manca, O. (2001), “Thermal and fluid dynamic behaviour of symmetrically heated vertical channels with auxiliary plate”, International Journal of Heat and Fluid Flow, Vol. 22, pp. 424–32.

2. Andreozzi, A., Campo, A. and Manca, O. (2000), “Aggregate intensification of natural convection between air and a vertical parallel‐plate channel by inserting an auxiliary plate at the mouth and appending collinear insulated plates at the exit”, in ASME‐HTD, Orlando, Florida, USA Vol. 366‐4, pp. 421–6.

3. Andreozzi, A., Manca, O. and Morrone, B. (1999), “Numerical analysis of natural convection in symmetrically heated vertical channels with an auxiliary parallel plate”, in NHTC‐HTD/117, Albuquerque, New Mexico, USA.

4. Aihara, T., Ohara, T., Sasago, A., Ukaku, M. and Gori, F. (1996), Augmentation of Free‐Convection Heat Transfer between Vertical parallel Plates by Inserting and Auxiliary Plate, 2nd European Thermal Sciences, Rome, Italy.

5. Bar‐Cohen, A. and Kraus, A.D. (1998), Advances in Thermal Modeling of Electronic Components and Systems, Hemisphere Publ. Co., ASME Press, New York, USA, Vol. 4.

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