High toughness, thermal resistance and excellent dielectric properties phenolic epoxy vinyl ester resin modified by hyperbranched polyimide

Abstract

Purpose Phenolic epoxy vinyl ester resin (PEVER) is an advanced resin matrix, which has excellent heat resistance, electrical insulation. However, the brittleness and poor toughness of its curing product limited its application, so this paper aims to modify the PEVER with hyperbranched polyimide (HBPI), so as to enhance the toughness, heat resistance and dielectric properties of PEVER. Design/methodology/approach Hexamethylene diisocyanate trimer was used as the central reactant. Methyl tetrahydrophthalic anhydride was used as the branching unit, stannous octoate was used as the catalyst and hydroquinone was prepared as the inhibitor. Then, the hyperbranched structure of HBPI was characterized by Fourier transform infrared spectrometer and 13C-NMR. Next, PEVER was mixed with different contents of HBPI, and then the authors tested its curing product. Findings It is found that with the addition of HBPI, the free volume of the system was increased and the content of polar groups was decreased in each unit space, so the dielectric constant (ε) and the dielectric loss (tanδ) were decreased. In addition, PEVER could be well toughened by HBPI and the thermal stability of PEVER was improved. Originality/value HBPI has excellent heat resistance. The addition of hyperbranched polymer increases the free volume of the system so it can slow down the transfer of stress and its nearly circular structure can absorb the impact energy from all directions. Moreover, an appropriate amount of free volume can decrease the dielectric constant of PEVER by reducing the content of polar groups.