Building‐in reliability ‐ implementation and benefits

Author:

Prendergast James,Murphy Eammon,Stephenson Malcom

Abstract

Argues that in the coming years the present methods of demonstrating reliability will no longer be feasible and alternative methods must be found. Deals with building‐in reliability (BIR) and the necessity to change from the standard end‐of‐line‐measurement technique of life test to a more proactive in‐line approach, where reliability can be measured by process parameters and reaction time is immediate, resulting in a continuous flow of reliable product to the end user. This approach will not eliminate the use of end‐of‐line monitoring, but will reduce the amount which needs to be carried out. Suggests that it will only be done to demonstrate that processes are operating to certain maximum failure rates, where the online controls will in fact guarantee that the reliability is much greater than that being demonstrated. Examines the customers’ attitude towards reliability, and points out that sharing of data will be essential if the BIR approach is to be successful. Outllines two examples which demonstrate the effectiveness of a BIR program and explains how, if implemented, it can be used to prevent the manufacture of potentially unreliable product.

Publisher

Emerald

Subject

Strategy and Management,General Business, Management and Accounting

Reference15 articles.

1. 1.Baglee, D.A., Nannemann, L. and Huang, C., “Building reliability into EPROMS”, 28th International Reliability Physics Symposium, New Orleans, March 1990, pp. 12‐18.

2. 2.Crook, D.L., “Evolution of VLSI reliability engineering”, 2nd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Bordeaux, October 1991, pp. 293‐312.

3. 3.Rathore, H.S., Wachnik, R.A., Filippi, R. and Gajda, J., “Building in reliability during product development in IBM microelectronics”, International Reliability Workshop, Lake Tahoe, October 1993, p. 137.

4. 4.Radojcic, R. and Thomas, R.W., “BIR customer and supplier perspectives”, International Reliability Workshop, Lake Tahoe, October 1993, p. TB 1.

5. 5.Gerling, W., “Integration of efforts for the reliability of microelectronic devices”, 4th European Symposium on Reliability of Electron Devices Failure Physics and Analysis, Bordeaux, October 1993, p. 51.

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Reliability—An Extension of Quality;India Studies in Business and Economics;2018-07-14

2. Total quality management: an examination of the writings from a UK perspective;The TQM Magazine;2001-04

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3