Abstract
PurposeThe purpose of this paper is to review the PackExpo Show (packaging technology), with emphasis on the new sensor innovations and applications to packaging on display.Design/methodology/approachIn‐depth interviews with exhibitors of sensors of all types at the PackExpo Show.FindingsSensing in packaging once was just weighing it but now it is product inspection, quality assessment, leakage and much more.Practical implicationsPackaging customers now have sensor technologies available to address government regulation concerns, product quality and the traditional weight and size factors.Originality/valueSensor users will find information about the latest in new sensing technologies which may assist them in solving current production problems.
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering
Cited by
4 articles.
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