Abstract
The flux residues on almost all soldered printed circuit boards are removed using the chlorofluorocarbon (CFC) 113. In just one year's time production of this solvent will almost certainly be curtailed, on a scale agreed internationally. This is a major issue that needs to be addressed urgently by the electronics assembly industry worldwide. This paper presents (i) the background that has led to the restrictions being placed on production and consumption of solvent 113, (ii) the international agreement and timetable for the implementation of the restrictions and (iii) the perceived opportunities that are available to the electronics assembly industry to meet this challenge.
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering
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