Microscale metal additive manufacturing of multi‐component medical devices

Author:

Cohen Adam,Chen Richard,Frodis Uri,Wu Ming‐Ting,Folk Chris

Abstract

PurposeThe purpose of this paper is to familiarize the reader with the capabilities of EFAB technology, a unique additive manufacturing process which yields fully assembled, functional mechanisms from metal on the micro to millimeter scale, and applications in medical devices.Design/methodology/approachThe process is based on multi‐layer electrodeposition and planarization of at least two metals: one structural and one sacrificial. After a period of initial commercial development, it was scaled up from a prototyping‐only to a production process, and biocompatible metals were developed for medical applications.FindingsThe process yields complex, functional metal micro‐components and mechanisms with tight tolerances from biocompatible metals, in low‐high production volume.Practical implicationsThe process described has multiple commercial applications, including minimally invasive medical instruments and implants, probes for semiconductor testing, military fuzing and inertial sensing devices, millimeter wave components, and microfluidic devices.Originality/valueThe process described in this paper is unusual among additive fabrication processes in being able to manufacture in high volume, and in its ability to produce devices with microscale features. It is one of only a few additive manufacturing processes that can produce metal parts or multi‐component mechanisms.

Publisher

Emerald

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference7 articles.

1. Chen, R., Brown, E. and Bang, C. (2004), “A compact low‐loss Ka‐band filter using 3‐dimensional micromachined integrated coax”, Proceedings of the 17th IEEE International Conference on MicroElectroMechanical Systems (MEMS 2004), Maastricht, The Netherlands, pp. 801‐4.

2. Cohen, A. (1999), “3‐D micromachining by electrochemical fabrication”, Micromachine Devices, March, pp. 6‐7.

3. Cohen, A., Zhang, G., Tseng, F.‐G., Frodis, U., Mansfield, F. and Will, P. (1999), “EFAB: rapid, low‐cost desktop micromachining of high aspect ratio true 3‐D MEMS”, Proceedings of the 12th IEEE International Microelectromechanical Systems Conference, Orlando, FL, pp. 244‐51.

4. Cohen, A., Zhang, G., Tseng, F.‐G., Mansfield, F., Frodis, U. and Will, P. (1998), “EFAB: batch production of functional, fully‐dense metal parts with micron‐scale features”, Solid Freeform Fabrication Symposium Proceedings, The University of Texas, Austin, TX, pp. 161‐8.

5. Kruglick, E., Cohen, A. and Bang, C. (2006), “EFAB technology and applications”, in Gad‐El‐Hak, M. (Ed.), The MEMS Handbook, 2nd ed., CRC Press, Boca Raton, FL, pp. 6‐1 6‐20.

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