A high‐performance lead‐free solder – the effects of In on 99.3Sn/0.7Cu-Reference-Cited by-同舟云学术

A high‐performance lead‐free solder – the effects of In on 99.3Sn/0.7Cu

Published:2001-08 Issue:2 Volume:13 Page:7-13
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:Soldering & Surface Mount Tech

Author:

Hwang Jennie S.,Guo Zhenfeng,Koenigsmann Holger

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference1 articles.

1. United States Patent No. 5 985 212, High‐Strength Lead‐Free Solder Materials.

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