Characterization of mechanical performance of Sn/Ag/Cu solder joints with different component lead coatings-Reference-Cited by-同舟云学术

Characterization of mechanical performance of Sn/Ag/Cu solder joints with different component lead coatings

Published:2004-04-01 Issue:1 Volume:16 Page:35-43
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:

Author:

Arra Minna,Castello Todd,Shangguan Dongkai,Ristolainen Eero

Abstract

The mechanical properties of Sn/Ag/Cu solder joints in combination with different component lead coating materials (Ni/Pd/Au, Sn/15 per cent Pb, Sn/2 per cent Bi, and Sn) are studied in this work using a lead pull test and free fall drop test. The results of this study show that the Sn/2 per cent Bi coated components provide the best performance under the drop impact loading followed by the Sn/15 per cent Pb, Sn and Ni/Pd/Au coated components. Failure modes and the structure of the coating surfaces were examined from cross‐sectioned samples using a scanning electron microscope. Furthermore, the wetting of the leads by the solder and thickness of the IMC layers were studied.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

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