1. Lead‐free solder process implementation for PCB assembly
2. Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X=Bi and Cu) solder joints
3. Kim, D.S., Yu, Q., Shibutani, T., Sadakata, N. and Inoue, T. (2004), “Effect of void formation on thermal fatigue reliability of lead‐free solder joints”, Thermomechanical Phenomena in Electronic Systems‐Proceedings of the Intersociety Conference, v 2,/Therm 2004‐Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 325‐9.
4. Lee, S.R., Yan, C.C., Karim, Z. and Huang, X. (2000), “Assessment on the effects of electroless nickel plating on the reliability of solder ball attachment to the bond pads of PBGA substrate”, Proceedings, 50th IEEE Electronic Components and Technology Conference, Las Vegas, NV, 21‐24 May, pp. 868‐73.
5. Evaluation of two novel lead‐free surface finishes