A novel high performance die attach-Reference-Cited by-同舟云学术

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A novel high performance die attach

Published:2000-04 Issue:1 Volume:12 Page:40-44
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:Soldering & Surface Mount Tech

Author:

Xie X.M.,Wang T.B.,Shi J.Z.,Ye R.Q.,Stubhan F.,Freytag J.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference8 articles.

1. Semiconductor Joining by the Solid-Liquid-Interdiffusion (SLID) Process

2. Bernstein, L. and Bartholomew, H. (1966), “Application of solid‐liquid interdiffusion (SLID) bonding in integrated‐circuit fabrication”, Trans. Met. Soc. AIME, Vol. 236, p. 405.

3. Low temperature interdiffusion in Au/In thin film couples

4. Lateral diffusion of In and formation of AuIn2in Au‐In thin films

5. Au-In bonding below the eutectic temperature

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of curing agent and curing substrate on low temperature curable silver conductive adhesive;Journal of Materials Science: Materials in Electronics;2019-01-02

2. Solid-liquid interdiffusion (SLID) bonding in the Au–In system: experimental study and 1D modelling;Journal of Micromechanics and Microengineering;2015-11-03

3. Diffusion soldering and brazing;Microjoining and Nanojoining;2008

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