Subject
Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science
Reference18 articles.
1. Caulfield, T., Benenati, J.A. and Acocella, J. (1993), “Surface mount array interconnections for high I/O MCM‐C to card assemblies”,Proceedings of International Conference on Multichip Modules, April, pp. 320‐25.
2. Correlation of uniaxial tension-tension, torsion, and multiaxial tension-torsion fatigue failure in a 63Sn-37Pb solder alloy
3. Constitutive relations for tin-based solder joints
4. Bending and Twisting of Internally Pressurized Thin-Walled Cylinder With Creep
5. Schroeder, S.A. and Mitchell, M.R. (1992), “Torsional creep behavior of 63Sn‐37Pb solder”,ASME Proceedings of Advances in Electronic Packaging, April, pp. 649‐53.