A study of SMT assembly processes for fine pitch CSP packages-Reference-Cited by-同舟云学术

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A study of SMT assembly processes for fine pitch CSP packages

Published:2004-12 Issue:3 Volume:16 Page:16-21
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:Soldering & Surface Mount Tech

Author:

Arra Minna,Geiger David,Shangguan Dongkai,Sjöberg Jonas

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference2 articles.

1. Solder balling of lead-free solder pastes

2. Vincent, J.H. (1994), “Lead‐free solders for electronic assembly”, GEC Journal of Research, Vol. 11 No. 2, pp. 76‐89.

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1. Effect of alloy particle size and stencil aperture shape on solder printing quality;Microelectronics International;2022-05-05

2. Defect minimization and process improvement in SMT lead-free solder paste printing: a comparative study;Soldering & Surface Mount Technology;2019-09-19

3. Electronic Packaging: Solder Mounting Technologies;Reference Module in Materials Science and Materials Engineering;2016

4. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components;Materials;2014-12-02

5. An Approach to Build Process-Oriented Basis for Causation-Based Multivariate SPC and Process Capability Analysis;Quality and Reliability Engineering International;2012-11-28

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