Mixed‐mode stress intensity factors of a three‐dimensional crack in a bonded bimaterial
Author:
Publisher
Emerald
Subject
Computational Theory and Mathematics,Computer Science Applications,General Engineering,Software
Reference18 articles.
1. A hypersingular boundary integral method for quasi‐static antiplane deformations of an elastic bimaterial with an imperfect and viscoelastic interface
2. An exact solution of the 3-D-problem of an interface semi-infinite plane crack
3. Hypersingular integral equation method for three-dimensional crack problem in shear mode
4. Chen, D.H. and Nisitani, H. (1993), “Stress intensity factors of a crack meeting the bimaterial interface”,Transactions of the Japanese Society of Mechanical Engineerings, Vol. 59 A, pp. 47‐53 (in Japanese).
5. Stresses in bonded materials with a crack perpendicular to the interface
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2. Numerical solutions for a nearly circular crack with developing cusps under shear loading;Acta Mechanica Solida Sinica;2011-10
3. Boundary element analysis of mixed‐mode stress intensity factors in an anisotropic cuboid with an inclined surface crack;Engineering Computations;2009-11-13
4. Mixed-mode stress intensity factors of 3D interface crack in fully coupled electromagnetothermoelastic multiphase composites;International Journal of Solids and Structures;2009-06
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