The Analysis of Manufacturing Processes for Plastic Ball Grid Arrays (PBGAs)-Reference-Cited by-同舟云学术

The Analysis of Manufacturing Processes for Plastic Ball Grid Arrays (PBGAs)

Published:1997-04-01 Issue:1 Volume:14 Page:16-19
ISSN:1356-5362
Container-title:Microelectronics International
language:en
Short-container-title:

Author:

Hill G.

Abstract

Plastic ball grid arrays (PBGAs) have begun to gain popularity in the electronic packaging market because of their advantages over peripheral leaded devices. In addition to good electrical performance, the PBGAs offer advantages to the assembler. The development of a successful assembly process for PBGAs requires an understanding of the PBGA itself and the assembly process. The key attributes required for high yield manufacturing of PBGAs are discussed. The emphasis is placed on the PBGA assembly parameters including proper PBGA handling, printing , stencil design, placement, reflow and inspection. This paper is intended to increase the understanding of the plastic ball grid array manufacturing process.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference19 articles.

1. 1 Mawer, A.,Bolton, S. and Mammo, E., ‘Plastic Ball Grid Array Solder Joint Reliability Considerations’, Journal of Surface Mount Technology, Vol.7,No.4, pp.16‐31, October(1994).

2. 2 Bernier, W., Ma,B., Mescher, P,Trivedi, A. and Vytlacil, E.,‘BGA vs QFP: A Summary of Tradeoffs for Selection of High I/O Components’, Proceedings Surface Mount International Conference, pp.181‐185, August(1994).

3. 3 Freyman, B., Briar, J. and Marrs, R., ‘Surface Mount Technology for Ball Grid Array Packaging’, Journal of Surface Mount Technology, Vol.7,No. 3, July(1994).

4. 4 Verguld, M. and Van Even, N.,‘Assembly Process for Miniaturized Consumer Electronics’,Journal of Surface Mount Technology, Vol.8,No.4, October(1995).

5. 5 Cole, M. and Caulfield, T., ‘A Review of Available Ball Grid Array (B.A.) Packages’, Proceedings Surface Mount International Conference, pp.207‐213, August(1995).

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