1. 1Szekely, V.,Mairta, Cs.,Rencz, M.,Benedek, Zs.andCourtois, B,‘Design for
Thermal Testability (DfTT) and a CMOS Realization’Sensors and Actuators,Vol. A55,No. I,pp. 29‐33(1996.)
2. 2Szekely, V.,Mairta, Cs.,Rencz, M.,Benedek, Zs.andCourtois, B,‘A New Approach:Design for Thermal Testability
(DfTT) of MCMs’., 2nd Multi‐Chip
Module Test Advanced Technology Workshop,Napa Valley, CA,
USA,September (1995).
3. 3 Pritchard, R. L.. ‘Electrical
Characteristics of Transistors’, Chapter 9 McGraw‐Hill, New York (1967).
4. 4 Siegel, B. S., Electronics, No. 51, p.121(1978)
5. 5 Diebold, E. J. and Luft. W., ‘Transient thermal Impedance
of Semiconductor Devices’, AIEE Transactions,Vol. 79,P. 719 (1961)