Characteristics of passive Ta‐resistive planes embedded in Al‐sheet “PCB” ‐ compatible for integrated MCM‐substrates or packaging carriers-Reference-Cited by-同舟云学术

Characteristics of passive Ta‐resistive planes embedded in Al‐sheet “PCB” ‐ compatible for integrated MCM‐substrates or packaging carriers

Published:1999-04-01 Issue:1 Volume:16 Page:18-20
ISSN:1356-5362
Container-title:Microelectronics International
language:en
Short-container-title:

Author:

Ivanov Philippov Philip,Markova Rassovska Milka,Georgiev Arnaudov Radosvet,Angelov Ianev Vassil,Draganova Gospodinova Minka

Abstract

Recent progress in the investigation of the material parameters of Al/Al2O3systems leads to an increase in the possibilities for using embedded TaOXN1‐X layers. The use of Al‐sheets as mechanical strength carriers in combination with vacuum‐deposited Al‐layers and electrochemically anodized Al2O3 structure requires study. This was found to create a periodic multilayer Al/Al2O3 structure. The material qualities of this system allow optimization in order to achieve high speed data processing and signal propagation. The existing studies using Al and Ta combination as well as the high resistance qualities of the modified TaOXN1‐X layers have shown satisfactory results. It can be concluded that the development of this new layer combination is possible in the multilayer carrier structures. Some preliminary research studies show a proper adhesion and satisfactory characteristics of the two integrated resistive planes in the multilayer combination Al/Al2O3//TaOXN1‐X/Ta2O5/Al.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference10 articles.

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