Lead‐free and No‐clean Soldering for Automotive Electronics*-Reference-Cited by-同舟云学术

Lead‐free and No‐clean Soldering for Automotive Electronics*

Published:1997-12 Issue:2 Volume:9 Page:5-8
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:Soldering & Surface Mount Tech

Author:

Shangguan D.,Gao G.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference19 articles.

1. 1Shangguan, D., Achari, A. and Green, W.‘Application of Lead‐Free Eutectic Sn‐Ag Solder in No‐Clean Thick Film Electronic Modules’,IEEE Transactions CPMT‐Part B, Vol.17, No.4, pp.603‐611 (1994).

2. 3 Shangguan, D.‘Lead‐Free Solder Development—Hybrid Products Applications’,Ford Internal Technical Report, January (1993).

3. 4Shangguan, D.‘Lead‐Free Solder Development‐PWB Applications’,Ford Internal Technical Report, May (1993).

4. 5 Shangguan, D. and Achari, A.‘Lead‐Free Solder Development for Automotive Electronics Packaging Applications’,Proceedings Surface Mount International Conference, San Jose, California, USA, pp. 423‐428, August (1995).

5. Evaluation of lead-free eutectic Sn-Ag solder for automotive electronics packaging applications

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