Intercomparison Results of a Gold Plated Nickel Solderability Reference Standard-Reference-Cited by-同舟云学术

Intercomparison Results of a Gold Plated Nickel Solderability Reference Standard

Published:1996-08-01 Issue:2 Volume:8 Page:49-53
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:

Author:

Hunt C.

Abstract

The development and characterisation of a prototype solderability reference standard based on a gold‐plated nickel sample has been described previously. This material has now been tested in an intercomparison with several European laboratories. The results presented here show that a high degree of repeatability is achievable. These results substantiate earlier ones and confirm this material's applicability as a solderability reference material.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference5 articles.

1. 1Hunt, C.P.andWallis, D. R., ‘Solderability Standard: A gold plated Nickel Reference Material’, Soldering & Surface Mount Technology, No. 21, pp.6‐9, October (1995).

2. 2Norme Française NF C90‐551m , ‘Electronic Components: General Alloys Fluxes and Creams for soft Soldering. Test Mewthod’, 1’ Union Technique de 1’ Electricite, Paris, France (1987).

3. 3Lea, C., ‘Surfaces of Standard Solderability’, Soldering & Surface Mount Technology, No. 5, pp. 46‐55 June (1990).

4. 4Hunt, C.F., ‘Instructions for Interlaboratory Comparison of a Gold Plated Nickel Solderability Reference Standard’, Report DMM(C)22, National physical Laboratory, Teddington, Middlesex, UK.

5. 5Hunt, C.P., ‘Intercompariosn Results of a Gold Plated Nickel Solderability Reference Standard’, Report DMM (C)25, National Physical Laboratory, Teddington, Middlesex, UK.