Surface insulation resistance (SIR) response to various processing parameters

Author:

Zou Ling,Hunt Christopher

Abstract

SIR testing is in practice carried out under a wider range of experimental conditions than those detailed in standards. The work presented here explores some of the issues when using a range of fluxes with various processing conditions and also examines the influence of substrate finish, test bias and the reflow process. These results clearly show that care must be exercised when using different test set‐ups, and when extrapolating between testing and use conditions. In particular the use of a 50V test bias voltage can produce anomalous results when compared to a 5V use environment.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference11 articles.

1. Bellcore TR‐NWT‐000078“SIR Test” 13.1.4 pp. 164‐6.

2. Brous, J. (1981), “Water‐soluble flux and its effect on PX board insulation resistance”, Electronic Packaging and Production, Vol. 21, part 7, pp. 79‐87.

3. Ellis, B.N. (1987), “Low voltage insulation resistance measurement of printed circuit and its implication”, EIPC, October 1987, Lausanne, France, pp. 21‐4.

4. Hunt, C. and Zou, L. (1999), “The impact of temperature and humidity conditions on surface insulation resistance values for various fluxes”, Soldering and Surface Mount Technology, Vol. 11 No. 1, pp. 36‐43.

5. IPC‐TM‐650 2.6.3.3“Surface insulation resistance, flux”.

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