The resin-flowing model in prepreg lamination of print circuit board

Abstract

Purpose This paper aims to show a resin-flowing model based on Darcy’s law to display the flowing properties of prepreg during lamination. The conformity between the model and experimental results demonstrates that it can provide a guideline on print circuit board (PCB) lamination. Design/methodology/approach Based on the theoretical derivations of Darcy’s law, this paper made an analysis on the flow of prepreg in the pressing process, according to which a theoretical model, namely, resin-flowing model was further formulated. Findings This paper establishes a resin-flowing model, according to which two experiment-verified conclusions can be drawn: first, the resin-flowing properties of material A and B can be improved when the heating rate is between 1.5 and 2.5 min/°C; second, increased pressure gradient can add the amount of flowing resin, mainly featured by increasing pressure and reducing filled thickness of prepreg. Originality/value This model provides guidance on setting lamination parameters for most kinds of prepregs and decreasing starvation risk for PCB production.