Is “black pad” still an issue for ENIG?
Author:
Publisher
Emerald
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Electroless Metallization of the Elements: Survey and Progress;ACS Applied Electronic Materials;2022-12-07
2. The formation of intermetallic layer structure of SAC405/Cu and SAC405/ENImAg solder joint interfaces;Soldering & Surface Mount Technology;2020-07-14
3. Experimental and DFT study of the effect of mercaptosuccinic acid on cyanide-free immersion gold deposition;RSC Advances;2020
4. Investigation of surface defects of electroless Ni plating by solder resist dissolution on the ENIG process;Microelectronic Engineering;2018-11
5. In Situ-Raman Spectroscopy and Electrochemical Characterization on Electroless Nickel Immersion Gold Process;ECS Transactions;2017-01-05
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