1. Aaen, P.H., Pla, J.A. and Wood, J. (2007), “Passive components: simulation and modeling”, in Aaen, P.H., Pla, J.A. and Wood, J. (Eds), Modeling and Characterization of RF and Microwave Power FETs, Cambridge University Press, Cambridge, MA, pp. 118‐47.
2. Al‐Taei, S., Haigh, D. and Passiopoulos, G. (2001), “Multilayer ceramic integrated circuits (MCIC) technology and passive circuit design”, Proc. 6th London Communication Symposium, Imperial College, London.
3. Balik, F. (2008), “A new method of AC analysis of electronic circuits by using multiparameter large‐change sensitivities”, Przegląd Elektrotechniczny, Vol. 84 No. 6, pp. 121‐4 (in Polish).
4. Balik, F. (2009), “Semi – symbolic method of ac analysis and optimization of electronic integrated circuits via multiparameter large change sensitivity”, Electroscope, Vol. 209, pp. 225‐34, available at: http://147.228.94.30/index.php?option=com, content&view=article&id=180:semi‐symbolic‐method‐of‐ac‐analysis‐and‐optimization‐of‐electronic‐integrated‐circuits‐&catid=26:konference‐eds‐2009&itemid=42 or http://147.228.94.30/images/PDF/Rocnik2009/EDS_2009/balik.pdf (accessed 17 December 2010)..
5. Balik, F. and Rodanski, B. (2004), “Calculation of symbolic sensitivities for large‐scale circuits in the sequence of expressions form via the transimpedance method”, Analog Integrated Circuits and Signal Processing, Vol. 40 No. 3, pp. 265‐76.