Parametric study of efficient thermal dissipation in an LED back light unit

Author:

Taek Kim Jin,Ro Lee Cheul,Kim Daesuk,Joon Baek Byung

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. Thermal analysis of LED package

2. Experimental investigation of microchannel coolers for the high heat flux thermal management of GaN-on-SiC semiconductor devices

3. Chen, K.C., Su, Y.K., Lin, C.L., Lu, Y.‐H., Li, W.‐L., Chuang, R.W., Huang, J.‐Q. and Chen, S.‐M. (2008), “Thermal management and novel package design of high power light‐emitting diodes”,Electronic Components and Technology Conference, Lake Buena Vista, FL, May, pp. 795‐7.

4. Study of Phosphor Thermal-Isolated Packaging Technologies for High-Power White Light-Emitting Diodes

5. Enhanced Thermal Dissipation and Light Output of GaN/Sapphire Light-Emitting Diode by Direct Cu Electroplating

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