Effects of microstrip line fabrication and design on high-speed signal integrity transmission of PCB manufacturing process

Abstract

Purpose As a common transmission line, the microstrip line plays an important role in high-speed circuits. The purpose of this paper was to investigate the effects of the circuit design of microstrip lines on the signal integrity (SI). In addition, the influence of the type and thickness of the solder resist ink on SI was analyzed to provide guidance for the related producing process design of printed circuit boards (PCBs). Design/methodology/approach Microstrip line properties consisting of shape, line-width/line-space ratio, reference layer design and as-covered solder resist ink were designed to measure the insertion loss (S21) in high-speed PCB. Findings The study showed that the insertion loss (S21) of straight, meander, snake-shaped and wavy microstrip lines was approximately consistent. A microstrip line with width/space ratio less than 0.96 is necessary, as the differential line closing produces a mutual interference. Reference layer including the discontinuous area should be repaired by adjusting the microstrip line parameters. With regard to the solder resist ink, the insertion loss of novel solder resist ink decreased by 0.163 dB/in at 12.9 GHz and 0.164 dB/in at 14 GHz, compared with traditional solder resist ink. Accordingly, the insertion loss effectively improved at a lower thickness of solder resist. Originality/value This paper demonstrated that the common designing factors of line shape, line/space ratio, reference layer and solder resist influence microstrip line SI in the significant reference of designer-making PCB layout.