MHD micropolar nanofluid flow through an inclined channel with entropy generation subjected to radiative heat flux, viscous dissipation and multiple slip effects

Author:

Roja A.,Gireesha B.J.,Prasannakumara B.C.

Abstract

PurposeMiniaturization with high thermal performance and lower cost is one of the advanced developments in industrial science chemical and engineering fields including microheat exchangers, micro mixers, micropumps, cooling microelectro mechanical devices, etc. In addition to this, the minimization of the entropy is the utilization of the energy of thermal devices. Based on this, in the present investigation, micropolar nanofluid flow through an inclined channel under the impacts of viscous dissipation and mixed convection with velocity slip and temperature jump has been numerically studied. Also the influence of magnetism and radiative heat flux is used.Design/methodology/approachThe nonlinear system of ordinary differential equations are obtained by applying suitable dimensionless variables to the governing equations, and then the Runge–Kutta–Felhberg integration scheme is used to find the solution of velocity and temperature. Entropy generation and Bejan number are calculated via using these solutions.FindingsIt is established to notice that the entropy generation can be improved with the aspects of viscous dissipation, magnetism and radiative heat flux. The roles of angle of inclination (α), Eckert number (Ec), Reynolds number (Re), thermal radiation (Rd), material parameter (K),  slip parameter (δ), microinertial parameter (aj), magnetic parameter (M), Grashof number (Gr) and pressure gradient parameter (A) are demonstrated. It is found that the angle of inclination and Grashof number enhances the entropy production while it is diminished with material parameter and magnetic parameter.Originality/valueElectrically conducting micropolar nanofluid flow through an inclined channel subjected to the friction irreversibility with temperature jump and velocity slip under the influence of radiative heat flux has been numerically investigated.

Publisher

Emerald

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science,Modeling and Simulation

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