Bond Strengths of Inner and Outer Leads on TAB Devices-Reference-Cited by-同舟云学术

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Bond Strengths of Inner and Outer Leads on TAB Devices

Published:1986-02 Issue:2 Volume:3 Page:42-48
ISSN:1356-5362
Container-title:Microelectronics International
language:en
Short-container-title:Microelectronics International

Author:

Liljestrand L.‐G.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference6 articles.

1. Hagge, J. K. 'Strain-Induced Failures in Plated-Thiough-Holes', Proceedings Printed Circuit World Convention, 1980, p.32.

2. Sato, S. and Tsunemitsu, Η. Ά New Approach To Reliability Built-in Connections', Proceedings 29th Electronic Components Conference, 1972, p.94.

3. Liu, T. S. 'Aspects of Gold-tin Bump Lead Interconnection Metallurgy', Proceedings ISHM Conference, 1977, p.120.

4. Process and Accelerated Aging Test of GANG Bonding for Gold-Plated TAB Outer Leads

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Gold‐Tin Solder Bumps for TAB Inner Lead Bonding with Reduced Bonding Pressure;Soldering & Surface Mount Technology;1992-03-01

2. An Introduction to Tape Automated Bonding Technology;Electronics Packaging Forum;1991

3. Overview of Tape Automated Bonding Technology;Circuit World;1990-01

4. Chip-to-Package Interconnections;Microelectronics Packaging Handbook;1989

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