A process to control diaphragm thickness with a provision for back to front alignment in the fabrication of polysilicon piezoresistive pressure sensor-Reference-Cited by-同舟云学术

A process to control diaphragm thickness with a provision for back to front alignment in the fabrication of polysilicon piezoresistive pressure sensor

Published:2003-12 Issue:4 Volume:23 Page:311-315
ISSN:0260-2288
Container-title:Sensor Review
language:en
Short-container-title:Sensor Review

Author:

Akhtar J.,Dixit B.B.,Pant B.D.,Deshwal V.P.,Joshi B.C.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Reference8 articles.

1. Akhtar, J., Dixit, B.B., Pant, B.D. and Deshwal, V.P. (n.d.), “Polysilicon piezoresistive pressure sensors based on MEMS technology”,IETE Technical Review(in press).

2. A method using V-grooves to monitor the thickness of silicon membrane with m resolution

3. Pressure sensitivity in anisotropically etched thin-diaphragm pressure sensors

4. A new theory for the anisotropic etching of silicon and some underdeveloped chemical micromachining concepts

5. Front-to-backside alignment using resist-patterned etch control and one etching step

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