Abstract
Purpose
– The paper aims to discuss the review of the most recent PackExpo show in Chicago with emphasis on the new robot innovations and applications on display.
Design/methodology/approach
– In-depth interviews with exhibitors of robots, integrators of robots and suppliers of robot accessories at the show.
Findings
– Robots continue to develop to match an ever-increasing number of packaging tasks.
Practical implications
– Customers may be surprised at the robot innovations and new applications to which robots are being applied in the packaging field.
Originality/value
– A review of some of the latest robot innovations and applications for packaging that one might have seen if they had been on the exhibition floor at the most recent Chicago PackExpo show.
Subject
Industrial and Manufacturing Engineering,Computer Science Applications,Control and Systems Engineering
Cited by
2 articles.
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