Liquid dispensing encapsulation in semiconductor packaging

Abstract

Liquid encapsulation techniques have been used extensively in advanced semiconductor packaging, including applications of underfilling, cavity‐filling, and glob top encapsulation. Because of the advanced encapsulation materials and the automatic liquid dispensing equipment involved, it is very important to understand the encapsulation material characteristics, equipment characteristics, encapsulation process development techniques in order to achieve the encapsulation quality and reliability. In this paper, the authors will examine the various considerations in liquid encapsulation applications and address the concerns on material characterization, automatic liquid dispensing equipment/process characterization and the encapsulation quality and reliability. The discussions will be helpful for future material and process development of semiconductor packages.