Multi‐layer thick‐film microwave components and measurements-Reference-Cited by-同舟云学术

Multi‐layer thick‐film microwave components and measurements

Published:2003-04-01 Issue:1 Volume:20 Page:17-20
ISSN:1356-5362
Container-title:Microelectronics International
language:en
Short-container-title:

Author:

Tian Zhengrong,Free Charles,Aitchison Colin,Barnwell Peter,Wood James

Abstract

The trend in wireless and mobile communications for broader bandwidth microwave circuitry, coupled with high packaging density and low cost fabrication has triggered investigations of new circuit configurations and technologies that meet these requirements. We have addressed these issues through the study of multilayer microwave structures using advanced thick‐film technology. The techniques described employ several layers of metal sandwiched by thick‐film dielectric. This leads to an efficient solution for system miniaturisation. The significance of this work is that it shows the multilayer approach to microwave structures, coupled with new thick‐film technology, offers a viable and economic solution to achieve high‐density, high‐performance microwave circuits.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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