Author:
Waini Iskandar,Jamrus Farah Nadzirah,Roșca Natalia C.,Roșca Alin V.,Pop Ioan
Abstract
Purpose
This study aims to investigate the dual solutions for axisymmetric flow and heat transfer due to a permeable radially shrinking disk in copper oxide (CuO) and silver (Ag) hybrid nanofluids with radiation effect.
Design/methodology/approach
The partial differential equations that governed the problem will undergo a transformation into a set of similarity equations. Following this transformation, a numerical solution will be obtained using the boundary value problem solver, bvp4c, built in the MATLAB software. Later, analysis and discussion are conducted to specifically examine how various physical parameters affect both the flow characteristics and the thermal properties of the hybrid nanofluid.
Findings
Dual solutions are discovered to occur for the case of shrinking disk (λ < 0). Stronger suction triggers the critical values’ expansion and delays the boundary layer separation. Through stability analysis, it is determined that one of the solutions is stable, whereas the other solution exhibits instability, over time. Moreover, volume fraction upsurge enhances skin friction and heat transfer in hybrid nanofluid. The hybrid nanofluid’s heat transfer also heightened with the influence of radiation.
Originality/value
Flow over a shrinking disk has received limited research focus, in contrast to the extensively studied axisymmetric flow problem over a diverse set of geometries such as flat surfaces, curved surfaces and cylinder. Hence, this study highlights the axisymmetric flow due to a shrinking disk under radiation influence, using hybrid nanofluids containing CuO and Ag. Upon additional analysis, it is evidently shows that only one of the solutions exhibits stability, making it a physically dependable choice in practical applications. The authors are very confident that the findings of this study are novel, with several practical uses of hybrid nanofluids in modern industry.
Subject
Mechanical Engineering,Aerospace Engineering,Computational Mechanics,Engineering (miscellaneous)
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