Abstract
The corrosion behaviour of copper in dilute HCl solution of pH 1.8‐2, in the absence and presence of different additives of Na2S, was studied by open circuit potential measurement, scanning electron microscopy and polarisation techniques. A complete covering of the surface with the strongly chemisorbed HS− is achieved at ≥10 ppm Na2S concentration. The addition of different concentrations of ethylene diamine (EDA) to HCl of pH 1.8‐2 promoted the dissolution rate, due to an increase in autocatalytic dissolution at the Cu metal surface. However, the synergistic inhibition effect between EDA and Na2S, resulting from the adsorption of HS− on the Cu metal, facilitated the adsorption of EDA.
Subject
General Materials Science,General Chemical Engineering
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