Two-phase analysis of interface level fluctuation in continuous casting mold with electromagnetic stirring

Author:

Maurya Ambrish,Jha Pradeep Kumar

Abstract

Purpose This investigation aims to analyze the steel-flux interface level fluctuation because of electromagnetic stirring and its process parameters in a continuous casting billet mold. Design/methodology/approach An un-coupled numerical model for electromagnetic field generation and a coupled numerical model of electromagnetic field and two-phase fluid flow have been developed. The two-phase fluid flow has been modeled using volume of fluid method, in which externally generated time-varying electromagnetic field is coupled and analyzed using magnetohydrodynamic method. Top surface standing wave stability criteria are used to study the criticality of interface stability. Findings Results show that application electromagnetic field for stirring increases the interface level fluctuation, specifically at the mold corners and near the submerged entry nozzle. The increase in current intensity and stirrer width barely affect the interface level. However, interface level fluctuation increases considerably with increase in frequency. Using stability criteria, it is found that at 20 Hz frequency, the ratio of height to wavelength of interface wave increases much above the critical value. The iso-surface of the interface level shows that at 20 Hz frequency, mold flux gets entrapped into the liquid steel. Practical implications The model may be used during optimization of in-mold electromagnetic stirrer to avoid mold flux entrapment and control the cast quality. Originality/value The study of mold level fluctuation in the presence of in-mold electromagnetic stirrer has rarely been reported. The criticality of stirrer process parameters on level fluctuation has not been yet reported. This study lacks in experimental validation; however, the findings will be much useful for the steelmakers to reduce the casting defects.

Publisher

Emerald

Subject

Applied Mathematics,Computer Science Applications,Mechanical Engineering,Mechanics of Materials

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